New partnership between Apple and Broadcom exceeding $30 billion for chip production in the US

Apple plans to produce 15 billion next-generation chips in the US as part of a deal with Broadcom exceeding $30 billion.

12punto 09 July 2026

Apple has entered into a large-scale collaboration with Broadcom for next-generation components to be used in wireless connectivity technologies. It was stated that the value of the agreement exceeds $30 billion, and that the production of 15 billion next-generation chips in the US is planned within this scope.

The collaboration between Apple and Broadcom takes the companies' long-standing supply relationship to a new stage.

The production in question is considered part of Apple's strategy to reduce its supply chain's dependence on a single region and to strengthen US-based production for critical components. Radio frequency components are of critical importance for the wireless connectivity performance used in the company's iPhone, Mac, and other devices.

The new production plan focuses on connectivity components used in Apple devices.

MODERNIZATION OF THE FORT COLLINS FACILITY

Within the scope of the agreement, a $1.5 billion modernization of the Fort Collins facility in Colorado is planned. The facility will produce high-quality radio frequency components and FBAR filters to be used in Apple devices.

Production with Broadcom will play an important role in Apple's supply of wireless connectivity components.

FBAR filters are among the essential components that help mobile devices process wireless signals more efficiently. For this reason, the agreement is significant not only for its production volume but also for the source of parts that could affect connectivity quality in Apple products.

Apple CEO Tim Cook emphasized that the parts to be produced in Fort Collins are critical for maintaining Apple's quality standards. Cook conveyed the message that the company's support for American manufacturing and innovation will continue.

Tim Cook highlighted the importance of the collaboration for Apple's production and innovation goals.

Broadcom CEO Hock Tan also pointed to the future of the long-term partnership between the two companies, expressing that they are proud to have technologies that connect the world produced in the US.

The new agreement comes at a time when global technology companies are reshaping their chip supply chains. For Apple, this step stands out as one of the important links in its goal of establishing a stronger and more diversified production infrastructure for the critical connectivity components used in its devices.